How to reach Tessera Technologies, Inc.
Description
When Tessera; Inc. was founded in 1990; we took our name from the Latin word for 'tile'; evoking an image of packaged chips being tiled closely together as in a mosaic. As demand for high performance; small size and better reliability in electronic devices was growing at an unprecedented rate; semiconductor companies found that silicon packaging - the physical interface between the silicon die and the circuit board - was a bottleneck that had to be overcome. To meet the need for small; fast and reliable packaging; and to make possible many of the electronic advances witnessed in the 1990s; Tessera developed packaging solutions that were virtually the same size and speed as the silicon chip itself. This technology became known as 'Chip Scale Packaging' or 'CSP'; and the technology has become broadly adopted. In fact; one million packages using Tessera's BGA CSP technology are produced each day for products ranging from cellular phones to network servers. Today we continue our work by providing a broad range of advanced packaging solutions - from stacked chip solutions to wafer-level packaging - and a full suite of customer services that enable electronics companies to meet their growing and changing packaging needs.
Tessera Technologies, Inc. Contacts email addresses & email formats
Discover specific contacts and email addresses at Tessera Technologies, Inc..
Request a full profile of Tessera Technologies, Inc. with decision maker contacts and email address:
